Modelling of rotational moulding process: analysis of process parameters and warpage on cycle times

Authors: Ianakiev, A.; Lim, K. K.

Source: Plastics, Rubber and Composites, Volume 36, Number 10, December 2007 , pp. 455-462(8)

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Abstract:

The analysis of heat transfer in the rotational moulding process is a non-linear multi-dimensional matter, which involves a number of process conditions and thermal parameters. The present study mostly involves dimensional analysis, the changing effects of the process parameters and conditions on the process times for different processing circumstances. They have been explored and compared by using the two-dimensional slip flow model from Lim and Ianakiev. The modelling helps to further identify and understand the dependence of the key thermal parameters due to external heating, external cooling, external–internal cooling and warpage on cycle times of the rotational moulding. In addition, the detail of the coincident node technique is discussed to present the key components of the conductivity matrix for an element 'abutting' a coincident node interface.

Keywords: ROTATIONAL MOULDING (ROTOMOULDING); HEAT TRANSFER; FINITE ELEMENT METHOD (FEM); COINCIDENT NODE TECHNIQUE; WARPAGE

Document Type: Research Article

DOI: http://dx.doi.org/10.1179/174328907X248221

Publication date: 2007-12-01

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