Deposition of polypyrrole insulating layer on copper monofilaments using low temperature plasma technique

Authors: Urbaniak-Domagała, W.; Krucińska, I.; Cybula, M.; Wrzosek, H.

Source: Materials Technology: Advanced Performance Materials, Volume 24, Number 1, March 2009 , pp. 24-28(5)

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Abstract:

Polypyrrole is a material with growing application in technique and medicine. It characterises with thermal durability, environmental resistance, and biocompatibility, electric conductivity regulated in wide range by using of dopants. In the following research plasma RF 13·56 MHz type H was used to obtained electroinsulating polypyrrole layers covering the surface of metallic (Cu) monofilament. The developed multilayer monofilaments can be used as the initial material in wearable electronics. Influence of polymerisation conditions such as deposition time and the pressure of monomer vapours on morphological structure of plasma polypyrrole was analysed by using SEM technique. The results of research show, that plasma polymer layers deposited on the Cu cylindrical substrates are uniform, with thickness dependent on the time deposition and resistant to action of dynamic loads on a loom.

Keywords: PLASMA DEPOSITION PROCESSES; POLYPYRROLE; LOW TEMPERATURE PLASMA SYNTHESIS; MORPHOLOGY OF PLASMA POLYMERS

Document Type: Research Article

DOI: http://dx.doi.org/10.1179/175355509X418007

Publication date: 2009-03-01

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