Effect of Ni on growing of intermetallic compound in interface of Sn2.5Ag0.7Cu0.1RE/Cu solder joint during aging

Authors: K. K. Zhang¹; C. Y. Li²; R. F. Qiu¹; H. X. Shi¹; Y. L. Wang¹

Source: Materials Science and Technology

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Abstract:

Aging treatment was implemented for the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joint under various temperatures simulating the service environment. The growing behaviour of the intermetallic compound at the soldering interface during aging was investigated. In the case of adding 0.1%Ni aged solder joint, the maximum growth activation energies of (Cu,Ni)₆Sn₅ and Cu₃Sn are 86.8 and 93.7 kJ mol⁻¹ respectively. The results reveal that the growth of intermetallic compound in the soldering interface can be suppressed, and the solder joint can be strengthened by adding proper quantities of Ni in the solder.

Keywords: Solder joint; Interface; Intermetallic compound; Aging

Document Type:

DOI: http://dx.doi.org/10.1179/1743284711Y.0000000131

Affiliations: 1: Henan Key Laboratory of Science and Processing Technology of Nonferrous Metals, Henan University of Science and Technology, Luoyang 471003, China 2: School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China

Appeared or available online: February 2, 2012