Transient liquid phase bonding of 6061-15 wt-%SiCp in argon environment using Cu powder interlayer
Source: Materials Science and Technology, Volume 25, Number 12, December 2009 , pp. 1489-1494(6)
Publisher: Maney Publishing
Abstract:The transient liquid phase bonding of 6061-15 wt-%SiCp composite using 50 μm thick copper powder interlayer at 560°C temperature, 0·2 MPa pressure, with five different holding times (20 min, 1, 2, 3 and 6 h) in argon environment has been investigated. The rejection of oxide at periphery on completion of isothermal solidification and elimination of void at bond interface through solid state diffusion were the main reasons of achieving adequate joint efficiency (89%) with 6 h holding.
Document Type: Research Article
Affiliations: 1: Department of Metallurgical and Materials Engineering, National Institute of Technology, Durgapur, Durgapur 713209, West Bengal, India;, Email: email@example.com 2: Welding Technology Center, Department of Metallurgical and Material Engineering, Jadavpur University, Kolkata 700032, West Bengal, India 3: Central Research Facility, Indian Institute of Technology, Kharagpur 721302, West Bengal, India
Publication date: 2009-12-01
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