Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites
Authors: Babaghorbani, P.1; Nai, S.M.L.2; Gupta, M.1
Source: Materials Science and Technology, Volume 25, Number 10, October 2009 , pp. 1258-1264(7)
Publisher: Maney Publishing
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Abstract:
In the present study, copper at the nanometer length scale is integrated with Sn-3·5Ag using the technique of powder metallurgy incorporating energy efficient microwave sintering. Superior mechanical characteristics were realised for the formulations containing nanometer length scale copper in excess of 1 vol.-%. Sn-3·5Ag reinforced with 2·5 vol.% nanosize copper particulates exhibited the best overall mechanical characteristics. Particular emphasis is placed on studying the effect of the increasing presence of nanosize copper particulates on the microstructure and property evolution of the Sn-3·5Ag matrix.Keywords: LEAD-FREE SOLDER; METAL MATRIX NANOCOMPOSITES; MECHANICAL BEHAVIOUR; MICROWAVE SINTERING
Document Type: Research article
DOI: 10.1179/174328408X378582
Affiliations: 1: Materials Division, Department of Mechanical Engineering, National University of Singapore, 9 Engineering Drive 1, Singapore 117576 2: Minerals, Metals and Materials Technology Centre National University of Singapore, 9 Engineering Drive 1, Singapore 117576
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