Reactive diffusion bonding of SiC_p/Al composites by insert layers of mixed powders

Authors: Huang, J. H.; Dong, Y. L.; Wan, Y.; Zhang, J. G.; Zhou, G. A.

Source: Materials Science and Technology, Volume 21, Number 10, October 2005 , pp. 1217-1221(5)

Buy & download fulltext article:

Price: $48.00 plus tax (Refund Policy)

Abstract:

Mixed Al–Si, Al–Si–SiC and Al–Si–W powders were employed as insert layers to reactive diffusion bond SiC_p/6063 metal matrix composites (MMC). The results show that using mixed Al–Si–SiC powder as insert layers, SiC_p/6063 MMC can be reactive diffusion bonded by a composite joint. Because of the SiC segregation, however, there are a number of porous zones in the joining layer, which result in the low shear strength of the joints reactive diffusion bonded by the insert layer of mixed Al–Si–SiC powder, even lower than those bonded by the insert layer of mixed Al–Si powder. The Ti added in the insert layer obviously improved the joint strength of the mixed Al–Si–SiC powder. Nearly all the W added into the insert layer of Al–Si–W reacts with Al to form intermetallic WAl₁₂ during bonding. The reaction between the W and Al facilitates the formation of a dense joint of high quality, in addition the WAl₁₂ has a reinforcing effect on the joints, which enables the joints bonded by the insert layer of mixed Al–Si–W powder to have a high shear strength.

Keywords: REACTIVE DIFFUSION BONDING; INSERT LAYER; SICP/AL MMCS

Document Type: Research Article

DOI: http://dx.doi.org/10.1179/174328405X51631

Publication date: 2005-10-01

More about this publication?

Authors wishing to cite fast track papers should give the journal name and the article DOI. This will enable reference linking via CrossRef and allow forward and backward citation tracking systems to associate the fast track citation with the final journal reference.
Materials Science and Technology is the successor of two previous titles, for which digitised archives are available: Metal Science (Vols. 1—17; 1967—84) and Metals Technology (Vols. 1—11; 1974—84).
Editorial Board
Information for Authors
Subscribe to this Title
Terms & Conditions
Online submission site
ingentaconnect is not responsible for the content or availability of external websites