Kinetics of intermetallic compound layer growth and interfacial reactions between Sn–8Zn–5In solder and bare copper substrate

Authors: Kim, D.-G.; Jung, H.-S.; Jung, S.-B.

Source: Materials Science and Technology, Volume 21, Number 3, March 2005 , pp. 381-386(6)

Buy & download fulltext article:

Price: $48.00 plus tax (Refund Policy)

Abstract:

The growth kinetics of the intermetallic compound layer formed between Sn–8Zn–5In solder and bare Cu substrate by solid-state isothermal aging were examined at temperatures between 70 and 150°C for times up to 100 days. Experimental results showed that the intermetallic compound observed on the bare copper substrate was γ-Cu₅Zn₈ and its thickness increased with ageing temperature and time. The layer growth of the intermetallic compound in the couple of the Cu/Zn satisfied the parabolic law at the given temperature range. As a whole, because the values of time exponent (n) were approximately 0·5, the layer growth of the intermetallic compound was considered to be mainly controlled by diffusion mechanism over the temperature range studied. The apparent activation energy for growth of the γ-Cu₅Zn₈ intermetallic compound was 62 kJ mol⁻¹.

Keywords: INTERMETALLIC COMPOUNDS; ACTIVATION ENERGY; SN-ZN-IN SOLDER; INTERFACIAL REACTION

Document Type: Research Article

DOI: http://dx.doi.org/10.1179/174328405X27061

Publication date: 2005-03-01

More about this publication?

Authors wishing to cite fast track papers should give the journal name and the article DOI. This will enable reference linking via CrossRef and allow forward and backward citation tracking systems to associate the fast track citation with the final journal reference.

To see the complete content of Metal Science, the predecessor to Materials Science and Technology, going back to 1967, please click here.
Editorial Board
Information for Authors
Subscribe to this Title
Terms & Conditions
Online submission site
ingentaconnect is not responsible for the content or availability of external websites