Authors: Sebastian, M. T.; Jantunen, H.

Source: International Materials Reviews, Volume 53, Number 2, March 2008 , pp. 57-90(34)

Publisher: Maney Publishing

Abstract:

Small, light weight and multifunctional electronic components are attracting much attention because of the rapid growth of the wireless communication systems and microwave products in the consumer electronic market. The component manufacturers are thus forced to search for new advanced integration, packaging and interconnection technologies. One solution is the low temperature cofired ceramic (LTCC) technology enabling fabrication of three-dimensional ceramic modules with low dielectric loss and embedded silver electrodes. During the past 15 years, a large number of new dielectric LTCCs for high frequency applications have been developed. About 1000 papers were published and ∼500 patents were filed in the area of LTCC and related technologies. However, the data of these several very useful materials are scattered. The main purpose of this review is to bring the data and science of these materials together, which will be of immense help to researchers and technologists all over the world. The commercially available LTCCs, low loss glass phases and researched novel materials are listed with properties and references. Additionally, their high frequency and thermal performances are compared with the other substrate material options such as high sintering temperature ceramics and polymers, and further improvements in materials' development required are discussed.

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Keywords: TEMPERATURE COMPENSATION; SHRINKAGE; CONSTRAINT SINTERING; Q VALUE; GLASS; DIELECTRIC; PERMITTIVITY; LTCC

Document Type: Research Article

DOI: http://dx.doi.org/10.1179/174328008X277524

Publication date: 2008-03-01

More about this publication?

• The archive of International Materials Reviews has three previous titles. The full archive is available online, and each title has a separate page of volumes. Please see Metallurgical Reviews , for volumes 1-16, International Metallurgical Reviews for volumes 17-20 and International Metals Reviews for volumes 21-31

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