Fluxless soldering

Authors: Jacobson, D. M.; Humpston, G.

Source: International Materials Reviews, Volume 51, Number 5, October 2006 , pp. 313-328(16)

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Abstract:

Soldering without the use of liquid fluxes is frequently demanded for assembly of electronic, optical and mechanical components because these chemicals and their residues can adversely affect performance. Chemical fluxes operate by removing oxide films from metal surfaces, which otherwise impede the spreading and wetting that is so essential for successful soldering and joint formation. Fluxless soldering processes employ alternative strategies to achieve the same end. Typically the oxide films are removed by reduction, displacement or dissolution; alternatively they are simply prevented from forming in the first place by suitably modifying the surfaces of the joints. The range of conditions required for successful fluxless soldering and how these are being achieved are reviewed with reference to specific case studies described in the scientific and technical literature.

Keywords: OXIDE REMOVAL; ALUMINIUM JOINING; PREFORMS; DIFFUSION SOLDERING; SOLDERS; SURFACE OXIDES; FLUXLESS SOLDERING; SOLDERING

Document Type: Research Article

DOI: http://dx.doi.org/10.1179/174328006X102547

Publication date: 2006-10-01

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The archive of International Materials Reviews has three previous titles. The full archive is available online, and each title has a separate page of volumes. Please see Metallurgical Reviews , for volumes 1-16, International Metallurgical Reviews for volumes 17-20 and International Metals Reviews for volumes 21-31
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