Antifriction coatings of Pb‐Sn‐Cu alloy electro-deposited from methanesulphonate bath

Authors: Danilov, F I; Protsenko, V S; Vasil’eva, E A; Kabat, O S

Source: Transactions of the Institute of Metal Finishing, Volume 89, Number 3, May 2011 , pp. 151-154(4)

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Abstract:

Electrodeposition of antifriction Pb?Sn?Cu coatings from a bath based on methanesulphonic acid (MSA) has been investigated. The bath contains two specially selected organic additives which modify both the structure and the appearance of deposits, prevent the oxidisation of Sn(II) ions and allow the increase of tin content in deposits. The antifriction lead (?90%)?tin (?8%)?copper (?2%) films are deposited from the MSA-electrolyte at a current density of 4 A dm^?2 and a bath temperature of about 20?25°C. Inhibition of the Sn²⁺ ions discharge reaction is observed when the ternary alloy is deposited on the cathode. The Cu²⁺ ions discharge proceeds at a diffusion limiting current. Simultaneous co-deposition of copper has no effect on the kinetics of both lead and tin electrodeposition. Wear characteristics of the deposits from the methanesulphonate bath do not differ from those obtained from the usual fluoroborate bath.

Keywords: Anodic coating formation; Aluminium; Lattice defects; Antifriction coatings; Alloy electrodeposition; Lead?tin?copper; Methanesulphonic acid

Document Type: Original Article

DOI: http://dx.doi.org/10.1179/174591911X13013062414016

Affiliations: 1Ukrainian State University of Chemical Engineering

Publication date: 2011-05-01

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