Comparison of simulated pulse plating processes to practical experiments

Authors: Hansal, S.; Linauer, L.; Hansal, W. E. G.

Source: Transactions of the Institute of Metal Finishing, Volume 87, Number 2, March 2009 , pp. 102-108(7)

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Abstract:

The development of any pulse sequence is a highly knowledge based process. Beside the knowledge of electrochemical electrolyte properties, the tailoring of the actual field line distribution and the local surface potentials via the applied pulse sequence is the main focus of the scientific development. The combination of pulse plating and numerical simulation offers a very high success rate for definition of pulse plating processes. Simulation tools are the only option to study current distribution and potential fields and are applicable for any possible electrolyte system and cell geometry. For developing a pulse plating sequence it is of major importance that the effect of single pulses within a pulse sequence can be calculated stepwise in high precision, taking into account the change of the substrate surface and geometry after each pulse step. Only in this way can the exact influence of cathodic and anodic pulse steps be retrieved. Additionally, the consideration of shieldings and cell geometry can be performed in parallel. Within this work a detailed study of the correlation between experimental data and the results of numerical simulation was performed focusing on the system Watts Nickel on steel. The conformity revealed by this study is excellent. The numerical simulation tool can be used for development and optimisation of pulse plating processes, if a stepwise, shape alteration including mathematical algorithm is used.

Keywords: POTENTIAL MAP; COMPUTER SIMULATION; PULSE PLATING; CURRENT DISTRIBUTION; WATTS NICKEL

Document Type: Research Article

DOI: http://dx.doi.org/10.1179/174591909X424825

Publication date: 2009-03-01

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