Transactions of the Institute of Metal Finishing

Editorial
pp. 55-55(1)
Author: Larson, Clive

Bulletin
pp. 56-59(4)

Walther Hermann Nernst
pp. 60-60(1)
Author: Gabe, D.R.

President's Reply to Letters in Transactions
pp. 61-61(1)
Author: Briggs, R.S.

Current Literature
pp. 62-63(2)

Chromium Plating,
pp. 63-63(1)
Author: Pearson, T.

Influence of additives and plating parameters on morphology and mechanical properties of copper coatings obtained by pulse electrodeposition
pp. 64-71(8)
Authors: Imaz, N.; García-Lecina, E.; Suárez, C.; Díez, J.A.; Rodríguez, J.; Molina, J.; García-Navas, V.

Pulse reversal plating of nickel-cobalt alloys
pp. 72-77(6)
Authors: Tang, P.T.; Jaskula, M.; Kubiczek, M.; Mizushima, I.; Pantleon, K.; Arentoft, M.

Implementation of gold deposition by pulse currents for optoelectronic devices
pp. 78-84(7)
Authors: Roy, S.; Caprodossi, S.

Electrodeposition of zinc-nickel alloy by pulse plating using non-cyanide bath
pp. 85-89(5)
Authors: Mohan, S.; Ravindran, V.; Subramanian, B.; Saravanan, G.

Influence of process parameters on crack formation in direct current and pulse reversal plated hard chromium
pp. 90-96(7)
Authors: Leisner, P.; Belov, I.

Effect of frequency on pulse electrolytic colouring process of anodised aluminium
pp. 97-101(5)
Authors: Zemanová, M.; Gál, M.; Chovancová, M.

Comparison of simulated pulse plating processes to practical experiments
pp. 102-108(7)
Authors: Hansal, S.; Linauer, L.; Hansal, W.E.G.