Author: Rashwan, S. M.

Source: Transactions of the Institute of Metal Finishing, Volume 85, Number 4, July 2007 , pp. 217-224(8)

Publisher: Maney Publishing

Abstract:

A plating bath containing Zn sulphate, Cu sulphate, sodium sulphate and glycine is described for depositing smooth, bright and uniform Zn?Cu alloys containing 8?92%Zn. Cathodic polarisation, cathodic current efficiency and deposit composition were determined under different plating conditions. The results were consistent with the behaviour of a regular plating system with Cu being the preferentially depositable metal. The Zn content in the deposits increased with current density and concentration of Zn in the bath but decreased with increasing bath Cu concentration and temperature. X-ray diffraction, anodic linear sweep voltammetry and scanning electron microscope were used to examine the structure and morphology of the deposited alloys. The deposited alloys consisted of a single solid solution phase with a face centred cubic structure.

Keywords: SULPHATE BATH; GLYCINE; ZN-CU; ELECTRODEPOSITION

Document Type: Research Article

DOI: http://dx.doi.org/10.1179/174591907X216440

Publication date: 2007-07-01

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