Pulse plating of nickel: influence of electrochemical parameters and composition of electrolyte

Authors: Halmdienst, M.; Hansal, W. E. G.; Kaltenhauser, G.; Kautek, W.

Source: Transactions of the Institute of Metal Finishing, Volume 85, Number 1, January 2007 , pp. 22-26(5)

Publisher: Maney Publishing

Buy & download fulltext article:

OR

Price: $48.00 plus tax (Refund Policy)

Abstract:

In this paper, the influence of the electrochemical parameters and the composition of the electrolyte on the properties of the deposits in pulse plating of nickel will be discussed. The characteristics and the electrochemical behaviour of a nickel sulphamate bath with and without organic additives were derived from fundamental electrochemical experiments. Plating experiments using pulsed current for the deposition revealed the resulting layer properties.

The addition of organic bath additives strongly influences the properties of the deposited nickel layers. While the hardness of the layers can be considerably improved by organic additives in the plating electrolyte, these additives can interfere with the freshly deposited nickel surface during the off-time of the pulse sequence.

Keywords: NICKEL; HARDNESS; PULSE PLATING; ORGANIC ADDITIVES

Document Type: Research Article

DOI: http://dx.doi.org/10.1179/174591907X161964

Publication date: 2007-01-01

More about this publication?
Related content

Tools

Key

Free Content
Free content
New Content
New content
Open Access Content
Open access content
Subscribed Content
Subscribed content
Free Trial Content
Free trial content

Text size:

A | A | A | A
Share this item with others: These icons link to social bookmarking sites where readers can share and discover new web pages. print icon Print this page