Transactions of the Institute of Metal Finishing

IMF news
pp. 1-2(2)

Particle filtration in industrial scale electrophoretic deposition processes
pp. 3-6(4)
Author: Hope, Peter

Editorial
pp. 6-6(1)
Authors: Campbell, Sheelagh; Farr, Peter

Current literature
pp. 6-6(1)

A new perspective for Pulse Plating
pp. 7-7(1)
Author: Hansal, Wolfgang

Electrodeposition - a versatile tool for the surface engineer
pp. 8-13(6)
Author: Wilcox, G.D.

Minutes of the Annual General Meeting
pp. 14-15(2)

The Report of Council October 2006
pp. 16-19(4)

Pulse plating of nickel: influence of electrochemical parameters and composition of electrolyte
pp. 22-26(5)
Authors: Halmdienst, M.; Hansal, W.E.G.; Kaltenhauser, G.; Kautek, W.

Pulse plating of sacrificial Mn-Cu alloys from sulphate bath
pp. 27-33(7)
Authors: Mangolini, F.; Magagnin, L.; Cavallotti, P.L.

Pulse electrodeposited nickel molybdenum
pp. 34-39(6)
Authors: Suryanto,; Eagleton, T.S.; Earwaker, L.G.; Farr, J.P.G.; Jones, I.P.

Recent progress in pulse reversal plating of copper for electronics applications
pp. 40-45(6)
Authors: Leisner, P.; Møller, P.; Fredenberg, M.; Belov, I.

High conductivity silver nanocoatings on aluminium obtained from pulse plating techniques
pp. 46-50(5)
Authors: Suárez, C.; Chávez, E.; Díez, J.A.; Grande, H.; Guixá, R.

Pulse reversal plating of nickel alloys
pp. 51-56(6)
Author: Tang, P.T.