Electroless nickel plating with Cu²⁺ and dicarboxylic acids additives

Authors: Tarozaitė, R.; Selskis, A.

Source: Transactions of the Institute of Metal Finishing, Volume 84, Number 2, March 2006 , pp. 105-112(8)

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Abstract:

Electroless nickel plating in solutions containing acetate, lactate, citrate and glycine as ligand has been studied at pH 4·5. A decrease in nickel plating rate and an increase in P amount incorporated into the coatings have been found to be proportional to the increase in stability of Ni²⁺ ions complexes with organic acids ions. 0·2 mM CuSO₄ sufficiently stabilises all the studied electroless plating solutions and increases the nickel plating rate. The presence of dicarboxylic acid (malonic, succinic or adipic) along with Cu²⁺ in the plating solution increases the NiP plating rate, hypophosphite utilisation efficiency and decreases coatings roughness, they become brighter and smoother. These effects are more pronounced if dicarboxylic acid of higher molecular weight is used as an additive.

Keywords: ELECTROLESS NICKEL; DICARBOXYLIC ACID; CU2+ STABILISER

Document Type: Research Article

DOI: http://dx.doi.org/10.1179/174591906X114471

Publication date: 2006-03-01

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