Transactions of the Institute of Metal Finishing logo Maney Publishing logo

Publisher: Maney Publishing on behalf of the Institute of Metal Finishing

Volume 84, Number 2, March 2006
Key:
Free Content - Free Content
New Content - New Content
Subscribed Content - Subscribed Content
Free Trial Content - Free Trial Content

< previous issue | next issue > | all issues

Bulletin

Bulletin
pp. 57-60(4)

Book review

Book reviews
pp. 60-60(1)

Current literature

Current literature
pp. 61-61(1)

Articles

Review

Articles

Electrodeposition of platinum from platinum-ammine based baths
pp. 79-82(4)
Authors: Rao, C.R.K.; Pushpavanam, M.

Electrodeposition of Cu from acidic sulphate solutions in presence of Bis-(3-sulphopropyl)-disulphide (SPS)
pp. 83-93(11)
Authors: Bozzini, B.; D'Urzo, L.; Mele, C.; Romanello, V.

Effect of sintanol DS10 and halides on Cu(II) reduction kinetics
pp. 94-98(5)
Authors: Survila, A.; Mockus, Z.; Kanapeckaitė, S.; Samulevičienė, M.

Activation of copper surfaces in chemical deposition of composite nickel coatings
pp. 99-104(6)
Authors: Petrova, M.; Dobreva, E.k.; Noncheva, Z.

Electroless nickel plating with Cu2+ and dicarboxylic acids additives
pp. 105-112(8)
Authors: Tarozaitė, R.; Selskis, A.

< previous issue | next issue > | all issues

Key:
Free Content - Free Content
New Content - New Content
Subscribed Content - Subscribed Content
Free Trial Content - Free Trial Content
Share this item with others: These icons link to social bookmarking sites where readers can share and discover new web pages.
Page Help Click here for Page Help
Shopping cart
Tools
Sign in






Need to register?
Sign up here
Text size: A | A | A | A