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Publisher: Maney Publishing on behalf of the Institute of Metal Finishing

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Volume 84, Number 2, March 2006

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Bulletin

Bulletin
pp. 57-60(4)

Book review

Book reviews
pp. 60-60(1)

Current literature

Current literature
pp. 61-61(1)

Articles

Review

Articles

Electrodeposition of platinum from platinum-ammine based baths
pp. 79-82(4)
Authors: Rao, C.R.K.; Pushpavanam, M.

Electrodeposition of Cu from acidic sulphate solutions in presence of Bis-(3-sulphopropyl)-disulphide (SPS)
pp. 83-93(11)
Authors: Bozzini, B.; D'Urzo, L.; Mele, C.; Romanello, V.

Effect of sintanol DS10 and halides on Cu(II) reduction kinetics
pp. 94-98(5)
Authors: Survila, A.; Mockus, Z.; Kanapeckaitė, S.; Samulevičienė, M.

Activation of copper surfaces in chemical deposition of composite nickel coatings
pp. 99-104(6)
Authors: Petrova, M.; Dobreva, E.k.; Noncheva, Z.

Electroless nickel plating with Cu2+ and dicarboxylic acids additives
pp. 105-112(8)
Authors: Tarozaitė, R.; Selskis, A.

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