Sequential deposition of Cu–Ni by electron beam evaporation and its characterisation

Authors: Subramanian, B.; Jayachandran, M.; Jayakrishnan, S.

Source: Transactions of the Institute of Metal Finishing, Volume 84, Number 1, January 2006 , pp. 52-55(4)

Buy & download fulltext article:

Price: $48.00 plus tax (Refund Policy)

Abstract:

Sequential deposition of Cu–Ni was carried out on glass and mild steel substrates by electron beam evaporation technique. The films were vacuum annealed at 200°C for 1 h. A smooth deposit with 7·8 ?m thickness was observed using a profilometer. The polycrystalline nature with FCC structure of the films was determined with X-ray diffraction analysis. The uniform coverage of film surface was observed with atomic force microscopy (AFM). X-ray fluorescence (XRF) showed a change in composition for the vacuum annealed Cu–Ni film. A high transmittance in the visible region and a very low transmittance in the infrared region were observed for these films. Corrosion behaviour of the evaporated Cu–Ni films in 3·5% w/v NaCl solution was examined.

Keywords: CORROSION NYQUIST PLOT; ELECTRON BEAM EVAPORATION; METALLIC COATINGS; PVD

Document Type: Research Article

DOI: http://dx.doi.org/10.1179/174591906X97499

Publication date: 2006-01-01

More about this publication?