Home >> Technical Physics Letters, Volume 30, Number 6

Conditions preventing thermal breakdown in semiconductor devices

Authors: Tsendin, K.; Shmelkin, A.

Source: Technical Physics Letters, Volume 30, Number 6, June 2004 , pp. 525-528(4)

Publisher: MAIK Nauka/Interperiodica

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Abstract:

We present results facilitating the prediction of the possibility of thermal breakdown in semiconductor devices and selection of the working parameters preventing such breakdowns.

Document Type: Research article

DOI: http://dx.doi.org/10.1134/1.1773357

Affiliations: 1: Email: alibumbles@mail.ru

Publication date: 2004-06-01

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