Scientometrics

Critical and emerging technologies in Materials, Manufacturing, and Industrial Engineering: A study for priority setting
pp. 473-487(15)
Author: Bengisu M.

Constructing a patent citation map using bibliographic coupling: A study of Taiwan's high-tech companies
pp. 489-506(18)
Authors: Huang M-H.; Chiang L-Y.; Chen D-Z.

Publications and patents in nanotechnology
pp. 507-527(21)
Authors: Hullmann A.; Meyer M.

Author co-citation analysis of semiconductor literature
pp. 529-545(17)
Authors: Tsay M-y.; Xu H.; Wu C-w.

Scientific cooperation between Chile and Spain: Joint mainstream publications (1991-2000)
pp. 547-558(12)
Authors: Presmanes B.; Zumelzu E.

Internationalization of mathematical research
pp. 559-570(12)
Authors: Dang Y.; Zhang W.

Better late than never? On the chance to become highly cited only beyond the standard bibliometric time horizon
pp. 571-586(16)
Authors: Glänzel W.; Schlemmer B.; Thijs B.

Informetric studies using databases: Opportunities and challenges
pp. 587-608(22)
Authors: Hood W.W.; Wilson C.S.

OLAP and bibliographic databases
pp. 609-622(14)
Authors: Hudomalj E.; Vidmar G.

Data mining in a closed Web environment
pp. 623-640(18)
Authors: Faba-Pérez C.; Guerrero-Bote V.P.; De Moya-Anegón F.

Intellectual property and public research in biotechnology: the scientists opinion
pp. 641-656(16)
Authors: Coutinho M.; Balbachevsky E.; Holzhacker D.O.; da Costa Patrao D.; Vencio R.N.Z.; da Silva R.L.M.; Lucatelli M.L.G.; dos Reis L.F.; Marin M.A.

A method for identifying clusters in sets of interlinking Web spaces
pp. 657-672(16)
Authors: Musgrove P.B.; Binns R.; Page-Kennedy T.; Thelwall M.

Mathematical model of delay in the secondary literature publishing process
pp. 673-685(13)
Authors: Yu G.; Rong Y.; Li Y.

Relations of relative scientometric indicators
pp. 687-694(8)
Author: Vinkler P.

Comments on the paper “Developing English-language academic journals of China'
pp. 695-696(2)
Author: Gu Y.

Understanding academic journals of China. Response to Yinian Gu
pp. 697-700(4)
Authors: Li L.; Fenglian Z.