JOM

In the final analysis
pp. 2-2(1)
Author: Robinson, James

Letters to the Editor
pp. 4-5(2)

Items of note from the field, profession, and society
pp. 6-11(6)

Solidification defects revisited and semi-solid processing
pp. 12-12(1)
Author: Lewis, Daniel

Titanium investiment casting defects: A metallographic overview
pp. 13-16(4)
Authors: Cotton, J.; Clark, L.; Phelps, H.

The basics of modern semi-solid metal processing
pp. 17-20(4)
Author: Czerwinski, Frank

Flow visualization for semi-solid processing
pp. 21-23(3)
Authors: Ward, Philip; Atkinson, Helen

The microstructural characterization of semi-solid slurries
pp. 24-30(7)
Authors: Nafisi, Shahrooz; Ghomashchi, Reza

Pulse-thermal processing for electronic applications
pp. 31-31(1)
Author: Ott, Ronald

Flash-assist RTP for ultra-shallow junctions
pp. 32-34(3)
Authors: Camm, D.; Gelpey, J.; Thrum, T.; Stuart, G.; McCoy, S.

Numerical simulation of high-density plasma-arc processing of FePt nanoparticle films
pp. 35-38(4)
Authors: Sabau, Adrian; Dinwiddie, Ralph

High-density plasma-arc heating studies of FePt thin films
pp. 39-42(4)
Authors: Cole, Amanda; Thompson, Gregory; Harrell, J.; Weston, J.; Ott, Ronald

Pulsed-thermal processing of chemically synthesized FePt nanoparticles
pp. 43-45(3)
Authors: Shi, Shifan; Kang, Shishou; Lawson, J.; Jia, Zhiyong; Nikles, D.; Harrell, J.; Ott, R.; Kadolkar, P.

The pulse-thermal processing of NdFeB-based nanocomposite magnets
pp. 46-49(4)
Authors: Jin, Z.; Chakka, V.; Wang, Z.; Liu, J.; Kadolkar, P.; Ott, R.

An investigation of phase transformation behavior in sputter-deposited PtMn thin films
pp. 50-54(5)
Authors: Ji, C.; Ladwig, Peter; Ott, Ronald; Yang, Y.; Yang, Joshua; Chang, Y.; Linville, Eric; Gao, Jenny; Pant, Bharat

Lead-free implementation: Reliability, alloy development, and new technology
pp. 56-56(1)
Author: Chada, Srinivas

Novel rare-earth-containing lead-free solders with enhanced ductility
pp. 57-62(6)
Authors: Dudek, M.; Sidhu, R.; Chawla, N.

A synchrotron radiation x-ray microdiffraction study on orientation relationships between a Cu₆ Sn₅ and Cu substrate in solder joints
pp. 63-66(4)
Authors: Suh, J.; Tu, K.; Tamura, N.

The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging
pp. 67-74(8)
Authors: Deppisch, Carl; Fitzgerald, Thomas; Raman, Arun; Hua, Fay; Zhang, Charles; Liu, Pilin; Miller, Mikel

The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating
pp. 75-79(5)
Authors: Zeng, Kejun; Stierman, Roger; Abbott, Don; Murtuza, Masood

Presenting upcoming TMS meetings and calls for papers
pp. 80-87(8)

Reflections on a life of materials science: Robert Cahn and The Art of Belonging
pp. 88-88(1)
Author: Roncone, Kelly