Journal of Materials Science: Materials in Electronics

Complex impedance analysis of NaLaTiO₄ electroceramics
pp. 157-164(8)
Authors: Pradhan, Dillip; Samantaray, B.; Choudhary, R.; Thakur, Awalendra

Synthesis and ferroelectric properties of SrBi₂Ta₂O₉/Bi₄Ti₃O₁₂/p-Si multilayer thin films by Sol-Gel
pp. 165-169(5)
Authors: Wang, H.; Ren, M.

Effect of Ag content on the microstructure development of Sn-Ag-Cu interconnects
pp. 171-178(8)
Authors: Lu, Henry; Balkan, Haluk; Ng, K.

Template synthesized Cu-Se microstructures as resonant tunneling diodes
pp. 189-192(4)
Authors: Chaudhri, Meeru; Vohra, A.; Chakarvarti, S.; Kumar, Rajesh

Optical parameter studies of thermally evaporated As-Se-Sn glassy system
pp. 193-198(6)
Authors: Fouad, S.; El-Shazly, E.; Balboul, M.; Fayek, S.; El-Bana, M.

Diamond nanopatterns fabricated by room-temperature nanoimprinting technology with diamond molds using polysiloxane
pp. 199-203(5)
Authors: Kiyohara, Shuji; Fujiwara, Makoto; Matsubayashi, Fumio; Mori, Katsumi

Dielectric response of an epoxy resin when exposed to high temperatures
pp. 205-210(6)
Authors: Boudefel, A.; Gonon, P.

The influence of heat-treatment on the current-voltage behavior of the ZnO-Bi₂O₃ based varistors
pp. 211-217(7)
Authors: Li, Jianying; Li, Shengtao; Liu, Fuyi; Alim, M.

Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water
pp. 219-227(9)
Authors: Yu, D.; Jillek, W.; Schmitt, E.

Electrochemical migration of lead free solder joints
pp. 229-241(13)
Authors: Yu, D.; Jillek, W.; Schmitt, E.