Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys

Authors: Zhou, Haifei1; Guo, Jingdong2; Shang, Jian3

Source: Journal of Electronic Materials, Volume 41, Number 11, November 2012 , pp. 3161-3168(8)

Publisher: Springer

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Abstract:

Interfacial reactions between liquid Sn and electroless xFeNiP alloys (where x is the at.% of Fe) were investigated to determine the suitability of electroless Fe-Ni films as a potential under-bump metallization in solder interconnections. It was found that the interfacial reactions depended strongly on the Fe percentage in the electroless Fe-Ni alloys. The FeSn2 compound layer was observed at the interface of alloys with high atomic percentage of Fe, such as 55 at.% and 75 at.%, while both FeSn2 and Ni3Sn4 layers were found at the interface at low Fe concentration such as 25 at.%. The growth rate of interfacial intermetallic compounds and the amount of intermetallic whiskers grown on the FeNiP coatings decreased with increasing Fe percentage. The presence of FeSn2 phase in Fe-Ni alloys at different Fe concentrations was believed to result from the lower Gibbs free energy for FeSn2 formation in the Sn/FeNiP system, while the variation in the growth rate of the intermetallic layer with Fe concentration was related to the different growth rates of FeSn2 and Ni3Sn4 compounds.

Keywords: Electroless Fe-Ni; interfacial reaction; under-bump metallization

Document Type: Research Article

DOI: http://dx.doi.org/10.1007/s11664-012-2199-y

Affiliations: 1: Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, China 2: Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, China, Email: jdguo@imr.ac.cn 3: Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, China, Email: jkshang@imr.ac.cn

Publication date: November 1, 2012

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