Thermal Stress Analysis and Structure Parameter Selection for a Bi2Te3-Based Thermoelectric Module
Source: Journal of Electronic Materials, Volume 40, Number 5, May 2011 , pp. 884-888(5)
Abstract:The output power and conversion efficiency of thermoelectric modules (TEMs) are mainly determined by their material properties, i.e., Seebeck coefficient, electrical resistivity, and thermal conductivity. In practical applications, due to the influence of the harsh environment, the mechanical properties of TEMs should also be considered. Using the finite-element analysis (FEA) model in ANSYS software, we present the thermal stress distribution of a TEM based on the anisotropic mechanical properties and thermoelectric properties of hot-pressed materials. By analyzing the possibilities of damage along the cleavage plane of Bi2Te3-based thermoelectric materials and by optimizing the structure parameters, a TEM with better mechanical performance is obtained. Thus, a direction for improving the thermal stress resistance of TEMs is presented.
Document Type: Research Article
Affiliations: 1: School of Mechanical and Auto Engineering, South China University of Technology, Wushan RD, Tianhe District, Guangzhou, 510641, People’s Republic of China, Email: email@example.com 2: School of Mechanical and Auto Engineering, South China University of Technology, Wushan RD, Tianhe District, Guangzhou, 510641, People’s Republic of China
Publication date: May 1, 2011