Thermal Aging Effects on Cu Ball Shear Strength and Cu/Al Intermetallic Growth

Authors: Amistoso, Jose1; Amorsolo, Alberto2

Source: Journal of Electronic Materials, Volume 39, Number 10, October 2010 , pp. 2324-2331(8)

Publisher: Springer

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Abstract:

Intermetallic growth and ball shear behavior of annealed Cu wire bonds on Al have been studied. The shear strength of Cu ball bonds decreased with time, and ductile fracture was the dominant failure mode from 125°C to 150°C. Al pad peel-off occurred as the aging temperature was increased above 150°C. The overall Cu/Al intermetallic thickness exhibited parabolic behavior as a function of time. A linear correlation was established between ball shear strength, metal peel-off occurrence, and intermetallic growth. The Cu/Al intermetallic growth activation energy was 0.23 eV, and the intermetallics identified in the experiment were CuAl2 and CuAl.

Keywords: Al bond pad; Cu wire bond; CuAl; CuAl2; ball shear strength; ductile fracture; intermetallic growth; metal peel-off

Document Type: Research Article

DOI: http://dx.doi.org/10.1007/s11664-010-1320-3

Affiliations: 1: Department of Mining, Metallurgy, and Materials Engineering, University of the Philippines, Diliman, Quezon City, Philippines, Email: jose_omar.s.amistoso@up.edu.ph 2: Department of Mining, Metallurgy, and Materials Engineering, University of the Philippines, Diliman, Quezon City, Philippines, Email: alberto_jr.amorsolo@up.edu.ph

Publication date: October 1, 2010

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