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Volume 39, Number 1, January 2010

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Influence of Surface Modification with Carboxylic Acids on Performance of Polymer/Titania Photovoltaic Devices
pp. 1-7(7)
Authors: Geng, Hongwei; Qu, Qiyun; Chen, Chong; Wu, Huan; Wang, Mingtai

Free Content Effects of Growth Temperature and Postgrowth Annealing on Inhomogeneous Luminescence Characteristics of Green-Emitting InGaN Films
pp. 15-20(6)
Authors: Masui, Hisashi; Melo, Thiago; Sonoda, Junichi; Weisbuch, Claude; Nakamura, Shuji; DenBaars, Steven

Temperature-Dependent Studies of Si-Implanted Al0.33Ga0.67N with Different Annealing Temperatures and Times
pp. 21-28(8)
Authors: Moore, E.A.; Yeo, Y.K.; Gruen, G.J.; Ryu, Mee-Yi; Hengehold, R.L.

High-Sensitivity Nitride-Based Ultraviolet Photosensors with a Low-Temperature AlGaN Interlayer
pp. 29-33(5)
Authors: Lee, K.; Chang, P.; Chang, S.; Su, Y.; Wang, Y.; Liu, C.

Heavily Aluminum-Doped Epitaxial Layers for Ohmic Contact Formation to p-Type 4H-SiC Produced by Low-Temperature Homoepitaxial Growth
pp. 34-38(5)
Authors: Krishnan, B.; Kotamraju, S.P.; Melnychuk, G.; Das, H.; Merrett, J.; Koshka, Y.

Ex Situ Thermal Cycle Annealing of Molecular Beam Epitaxy Grown HgCdTe/Si Layers
pp. 43-48(6)
Authors: Farrell, S.; Brill, G.; Chen, Y.; Wijewarnasuriya, P.; Rao, Mulpuri; Dhar, N.; Harris, K.

Free Content Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys
pp. 56-69(14)
Authors: Gourlay, C.; Nogita, K.; Read, J.; Dahle, A.

Physical Properties of Sn96.5Ag3.5-Based Solders with Additions of Bi, Ge, and In
pp. 70-76(7)
Authors: Kaban, I.; Khalouk, K.; Köhler, M.; Hoyer, W.; Gasser, J.-G.

Conductive Anodic Filament (CAF) Formation Part I: the Influence of Water-Soluble Flux on Its Formation
pp. 85-91(7)
Authors: Caputo, Antonio; Turbini, Laura; Perovic, Doug

Conductive Anodic Filament Formation Part II: Electrochemical Reactions Leading to CAF
pp. 92-96(5)
Authors: Caputo, Antonio; Turbini, Laura; Perovic, Doug

Compression Stress–Strain Behavior of Sn-Ag-Cu Solders
pp. 97-104(8)
Authors: Lopez, Edwin; Vianco, Paul; Rejent, Jerome; George, Carly; Kilgo, Alice

Tin Pest in Sn-0.5Cu Lead-Free Solder Alloys: A Chemical Analysis of Trace Elements
pp. 105-108(4)
Authors: Leodolter-Dworak, Monika; Steffan, Ilse; Plumbridge, William; Ipser, Herbert

Size and Substrate Effects upon Undercooling of Pb-Free Solders
pp. 109-114(6)
Authors: Huang, Yu-chih; Chen, Sinn-wen; Wu, Kuang-siang

Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives
pp. 115-123(9)
Authors: Ho, Li-Ngee; Nishikawa, Hiroshi; Natsume, Naohide; Takemoto, Tadashi; Miyake, Koichi; Fujita, Masakazu; Ota, Koyu

Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization
pp. 124-131(8)
Authors: Xu, Hui; Liu, Changqing; Silberschmidt, Vadim; Chen, Zhong

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