@article {Liu:2007:0361-5235:179,
	author = "Liu, N. and Kuech, T.F.",
	title = "Interfacial Chemistry of InP/GaAs Bonded Pairs",
	journal = "Journal of Electronic Materials",
	volume = "36",
	number = "3",
	year = "2007",
	pages = "179-190",
	url = "http://www.ingentaconnect.com/content/klu/jem/2007/00000036/00000003/00000077",
	doi = "doi:10.1007/s11664-006-0077-1"
}

@article {Cai:2007:0361-5235:191,
	author = "Cai, Li and Zou, Min and Abu-Safe, Husam and Naseem, Hameed and Brown, William",
	title = "Understanding the Effects of Stress on the Crystallization of Amorphous Silicon",
	journal = "Journal of Electronic Materials",
	volume = "36",
	number = "3",
	year = "2007",
	pages = "191-196",
	url = "http://www.ingentaconnect.com/content/klu/jem/2007/00000036/00000003/00000012",
	doi = "doi:10.1007/s11664-006-0012-5"
}

@article {Chen:2007:0361-5235:197,
	author = "Chen, S.-W. and Chiu, C.-N. and Hsieh, K.-C.",
	title = "Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at 210C",
	journal = "Journal of Electronic Materials",
	volume = "36",
	number = "3",
	year = "2007",
	pages = "197-206",
	url = "http://www.ingentaconnect.com/content/klu/jem/2007/00000036/00000003/00000093",
	doi = "doi:10.1007/s11664-007-0093-9"
}

@article {Jang:2007:0361-5235:207,
	author = "Jang, J.W. and Lin, J.K. and Frear, D.R.",
	title = "Failure Morphology after the Drop Impact Test of the Ball Grid Array Package with Lead-Free Sn-3.8Ag-0.7Cu on Cu and Ni Under-Bump Metallurgies",
	journal = "Journal of Electronic Materials",
	volume = "36",
	number = "3",
	year = "2007",
	pages = "207-213",
	url = "http://www.ingentaconnect.com/content/klu/jem/2007/00000036/00000003/00000089",
	doi = "doi:10.1007/s11664-007-0089-5"
}

@article {Williams:2007:0361-5235:214,
	author = "Williams, M.E. and Moon, K.-W. and Boettinger, W.J. and Josell, D. and Deal, A.D.",
	title = "Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds",
	journal = "Journal of Electronic Materials",
	volume = "36",
	number = "3",
	year = "2007",
	pages = "214-219",
	url = "http://www.ingentaconnect.com/content/klu/jem/2007/00000036/00000003/00000071",
	doi = "doi:10.1007/s11664-006-0071-7"
}

@article {Moriuchi:2007:0361-5235:220,
	author = "Moriuchi, Hiroyuki and Tadokoro, Yoshihiro and Sato, Masahide and Furusawa, Takeshi and Suzuki, Noboru",
	title = "Microstructure of External Stress Whiskers and Mechanical Indentation Test Method",
	journal = "Journal of Electronic Materials",
	volume = "36",
	number = "3",
	year = "2007",
	pages = "220-225",
	url = "http://www.ingentaconnect.com/content/klu/jem/2007/00000036/00000003/00000030",
	doi = "doi:10.1007/s11664-006-0030-3"
}

@article {Lam:2007:0361-5235:226,
	author = "Lam, D.C.C. and Wang, J.",
	title = "Hygrothermal Delaminations in Lead-Free Solder Reflow of Electronic Packages",
	journal = "Journal of Electronic Materials",
	volume = "36",
	number = "3",
	year = "2007",
	pages = "226-231",
	url = "http://www.ingentaconnect.com/content/klu/jem/2007/00000036/00000003/00000088",
	doi = "doi:10.1007/s11664-007-0088-6"
}

@article {NOUSIAINEN:2007:0361-5235:232,
	author = "NOUSIAINEN, O. and PUTAALA, J. and KANGASVIERI, T. and RAUTIOAHO, R. and VAHAKANGAS, J.",
	title = "Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plastic Core Solder Ball Composite Joints in Low-Temperature Co-Fired Ceramic/Printed Wiring Board Assemblies",
	journal = "Journal of Electronic Materials",
	volume = "36",
	number = "3",
	year = "2007",
	pages = "232-241",
	url = "http://www.ingentaconnect.com/content/klu/jem/2007/00000036/00000003/00000066",
	doi = "doi:10.1007/s11664-006-0066-4"
}

@article {Bhattacharya:2007:0361-5235:242,
	author = "Bhattacharya, Swapan and Varadarajan, Mahesh and Chahal, Premjeet and Jha, Gopal and Tummala, Rao",
	title = "A Novel Electroless Process for Embedding a Thin Film Resistor on the Benzocyclobutene Dielectric",
	journal = "Journal of Electronic Materials",
	volume = "36",
	number = "3",
	year = "2007",
	pages = "242-244",
	url = "http://www.ingentaconnect.com/content/klu/jem/2007/00000036/00000003/00000058",
	doi = "doi:10.1007/s11664-006-0058-4"
}

@article {Hung:2007:0361-5235:245,
	author = "Hung, Kun and Hsieh, Ching and Yang, Wein and Tsai, Hui",
	title = "Synthesis of Nanometric-Sized Barium Titanate Powders Using Acetylacetone as the Chelating Agent in a Sol-Precipitation Process",
	journal = "Journal of Electronic Materials",
	volume = "36",
	number = "3",
	year = "2007",
	pages = "245-252",
	url = "http://www.ingentaconnect.com/content/klu/jem/2007/00000036/00000003/00000027",
	doi = "doi:10.1007/s11664-006-0027-y"
}

@article {Ding:2007:0361-5235:253,
	author = "Ding, Shi-Jin and Zhang, Min and Chen, Wei and Zhang, David and Wang, Li-Kang",
	title = "Memory Effect of Metal-Insulator-Silicon Capacitor with HfO2-Al2O3 Multilayer and Hafnium Nitride Gate",
	journal = "Journal of Electronic Materials",
	volume = "36",
	number = "3",
	year = "2007",
	pages = "253-257",
	url = "http://www.ingentaconnect.com/content/klu/jem/2007/00000036/00000003/00000003",
	doi = "doi:10.1007/s11664-006-0003-6"
}

@article {Tsukimoto:2007:0361-5235:258,
	author = "Tsukimoto, S. and Kabe, T. and Ito, K. and Murakami, M.",
	title = "Effect of Annealing Ambient on the Self-Formation Mechanism of Diffusion Barrier Layers Used in Cu(Ti) Interconnects",
	journal = "Journal of Electronic Materials",
	volume = "36",
	number = "3",
	year = "2007",
	pages = "258-265",
	url = "http://www.ingentaconnect.com/content/klu/jem/2007/00000036/00000003/00000094",
	doi = "doi:10.1007/s11664-007-0094-8"
}