Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plastic Core Solder Ball Composite Joints in Low-Temperature Co-Fired Ceramic/Printed Wiring Board Assemblies
Authors: NOUSIAINEN, O.; PUTAALA, J.; KANGASVIERI, T.; RAUTIOAHO, R.; VÄHÄKANGAS, J.
Source: Journal of Electronic Materials, Volume 36, Number 3, March 2007 , pp. 232-241(10)
Abstract:The thermal fatigue endurance of completely lead-free 95.5Sn4Ag0.7Cu/plastic core solder ball (PCSB) composite joint structures in low-temperature Co-fired ceramic/printed wiring board (LTCC/PWB) assemblies was investigated using thermal cycling tests over the temperature ranges of −40°C–125°C and 0°C–100°C. Two separate creep/fatigue failures initiated and propagated in the joints during the tests: (1) a crack along the intermetallic compound (IMC)/solder interface on the LTCC side of the joint, which formed at the high-temperature extremes; and (2) a crack in the solder near the LTCC solder land, which formed at the low-temperature extremes. Moreover, localized recrystallization was detected at the outer edge of the joints that were tested in the harsh (−40°C–125°C) test conditions. The failure mechanism was creep/fatigue-induced mixed intergranular and transgranular cracking in the recrystallized zone, but it was dominated by transgranular thermal fatigue failure beyond the recrystallized zone. The change in the failure mechanism increased the rate of crack growth. When the lower temperature extreme was raised from −40°C to 0°C, no recrystallized zone was detected and the failure was due to intergranular cracks.
Document Type: Research Article
Affiliations: Email: firstname.lastname@example.org
Publication date: March 1, 2007