Lead-Free Solder Reinforced with Multiwalled Carbon Nanotubes
Authors: Nai, S.M.L.; Wei, J.; Gupta, M.
Source: Journal of Electronic Materials, Volume 35, Number 7, July 2006 , pp. 1518-1522(5)
Abstract:In this study, varying weight percentages of multiwalled carbon nanotubes were successfully incorporated into 95.8Sn-3.5Ag-0.7Cu solder to synthesize novel lead-free composite solders. The composite solders were synthesized using a powder metallurgy route consisting of blending, compaction, sintering, and extrusion. The extruded materials were then characterized for their physical, thermal, and mechanical properties. With the addition of increasing weight percentage of carbon nanotubes, the composite solders experienced a corresponding decrease in density values and an improvement in wetting properties. The melting temperatures of the composite solders were found to be unchanged with additions of carbon nanotubes. However, improvements in the mechanical properties, in terms of microhardness and tensile properties, were observed with increasing weight percentages of carbon nanotubes.
Document Type: Regular Paper
Publication date: 2006-07-01