Creep-Constitutive Behavior of Sn-3.8Ag-0.7Cu Solder Using an Internal Stress Approach

Authors: Rist, Martin A.; Plumbridge, W.J.; Cooper, S.

Source: Journal of Electronic Materials, Volume 35, Number 5, May 2006 , pp. 1050-1058(9)

Publisher: Springer

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The experimental tensile creep deformation of bulk Sn-3.8Ag-0.7Cu solder at temperatures between 263 K and 398 K, covering lifetimes up to 3,500 h, has been rationalized using constitutive equations that incorporate structure-related internal state variables. Primary creep is accounted for using an evolving internal back stress, due to the interaction between the soft matrix phase and a more creep-resistant particle phase. Steady-state creep is incorporated using a conventional power law, modified to include the steady-state value of internal stress. It is demonstrated that the observed behavior is well-fitted using creep constants for pure tin in the modified creep power law. A preliminary analysis of damage-induced tertiary creep is also presented.


Document Type: Regular Paper

Publication date: May 1, 2006

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