Processability and Reliability of Nonconductive Adhesives (NCAs) in Fine-Pitch Chip-on-Flex Applications
Authors: Chiang, W.K.; Chan, Y.C.; Ralph, Brian; Holland, Andrew
Source: Journal of Electronic Materials, Volume 35, Number 3, March 2006 , pp. 443-452(10)
Abstract:The use of NCAs to form direct contact interconnections between chip bumps and substrate pads have become a viable option in interconnection technology for fine-pitch applications. However, the primary concerns with NCAs are their long-term reliability, stability, and consistent electrical performance in particulate interconnections. Results of assembly process studies and environmental testing using NCAs on flexible substrates are analyzed and discussed herein. An extensive design experiment was performed to determine which process parameters were critical in obtaining good electrical connections. A reliability evaluation of NCAs for flexible substrate applications was carried out to gain more insight into the failure mechanisms of this type of interconnect. Pressure cooker test results showed that failures occurring in NCA joints are primarily due to moisture absorption, which could lead to interfacial delamination at the substrate/adhesive interface, accompanied by hygroscopic swelling. NCAs with lower coefficients of thermal expansion also exhibited better contact resistance stability during high-temperature storage tests.
Document Type: Regular Paper
Publication date: March 1, 2006