Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Immersion Ag Surface Finish
Authors: Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min
Source: Journal of Electronic Materials, Volume 35, Number 2, February 2006 , pp. 310-318(9)
Abstract:The intermetallic compounds formed in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Ag/Cu pads are investigated. After reflow, scallop-shaped -Cu6Sn5 and continuous planar -(Cu0.9Ni0.1)6Sn5 intermetallics appear at the interfaces of the Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder joints, respectively. In the case of the Sn3Ag0.5Cu specimens, an additional -Cu3Sn intermetallic layer is formed at the interface between the -Cu6Sn5 and Cu pads after aging at 150°C, while the same type of intermetallic formation is inhibited in the Sn3Ag0.5Cu0.06Ni0.01Ge packages. In addition, the coarsening of Ag3Sn precipitates also abates in the solder matrix of the Sn3Ag0.5Cu0.06Ni0.01Ge packages, which results in a slightly higher ball shear strength for the specimens.
Document Type: Regular Paper
Publication date: 2006-02-01