Interfacial reactions in the pb-free composite solders with indium layers

Authors: Chen, Sinn-Wen; Lin, Shih-Kang; Yang, Ching-Feng

Source: Journal of Electronic Materials, Volume 35, Number 1, January 2006 , pp. 72-75(4)

Publisher: Springer

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Abstract:

A Pb-free composite solder is prepared with a Pb-free solder substrate and a plated-indium layer. The indium layer melts during the soldering process, wets the substrates, and forms a sound solder joint. Since the melting temperature of indium is 156.6°C, lower than that of the eutectic Sn-Pb, which is at 183°C, the soldering process can be carried out at a temperature lower than that of the conventional soldering process. Composite solder joints with three different Pb-free solders, Sn, Sn-3.5 wt.% Ag, and Sn-3.5 wt.% Ag-0.5 wt.% Cu, and two substrates, Ni and Cu, are prepared. The interfaces between the indium layer, Pb-free solder, and Ni and Cu substrate are examined. A good solder joint is formed after a 2-min reflow at 170°C. A very thick reaction zone at the indium/Pb-free solder interface and a thin reaction layer at the indium/substrate interface are observed.

Keywords: Indium; Pb-free solders; composite soldering

Document Type: Research Article

DOI: http://dx.doi.org/10.1007/s11664-006-0186-x

Affiliations: Email: swchen@che.nthu.edu.tw

Publication date: January 1, 2006

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