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Rahman and Osipowicz, T. and Chi, D.Z. and Wang, W.D.", title = "Effects of Prolonged Annealing on NiSi at Low Temperature (500C)", journal = "Journal of Electronic Materials", volume = "34", number = "8", year = "2005", pages = "1110-1114", url = "http://www.ingentaconnect.com/content/klu/jem/2005/00000034/00000008/art00004" } @article {Rizvi:2005:0361-5235:1115, author = "Rizvi, M.J. and Chan, Y.C. and Bailey, C. and Lu, H. and Islam, M.N. and Wu, B.Y.", title = "Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates", journal = "Journal of Electronic Materials", volume = "34", number = "8", year = "2005", pages = "1115-1122", url = "http://www.ingentaconnect.com/content/klu/jem/2005/00000034/00000008/art00005" } @article {Lin:2005:0361-5235:1123, author = "Lin, C.Y. and Fang, Y.K. and Chen, S.F. and Lin, C.S. and Chou, T.H. and Hwang, S.B. and Hwang, J.S. and Lin, K.I.", title = "Investigation of Structure and Properties of Nanocrystalline Silicon on Various Buffer Layers", journal = "Journal of Electronic Materials", volume = "34", number = "8", year = "2005", pages = "1123-1128", url = "http://www.ingentaconnect.com/content/klu/jem/2005/00000034/00000008/art00006" } @article {Kao:2005:0361-5235:1129, author = "Kao, Szu-Tsung and Duh, Jenq-Gong", title = "Interfacial Reactions and Compound Formation of Sn-Ag-Cu Solders by Mechanical Alloying on Electroless Ni-P/Cu Under Bump Metallization", journal = "Journal of Electronic Materials", volume = "34", number = "8", year = "2005", pages = "1129-1134", url = "http://www.ingentaconnect.com/content/klu/jem/2005/00000034/00000008/art00007" } @article {Chang:2005:0361-5235:1135, author = "Chang, Cheng-An and Chen, Sinn-Wen and Chiu, Chen-Nan and Huang, Yu-Chih", title = "Primary Solidification Phases of the Sn-Rich Sn-Ag-Cu-Ni Quaternary System", journal = "Journal of Electronic Materials", volume = "34", number = "8", year = "2005", pages = "1135-1142", url = "http://www.ingentaconnect.com/content/klu/jem/2005/00000034/00000008/art00008" } @article {Tan:2005:0361-5235:1143, author = "Tan, S.C. and Chan, Y.C. and Lui, Nelson S.M.", title = "Process Optimization to Overcome Void Formation in Nonconductive Paste Interconnections for Fine-Pitch Applications", journal = "Journal of Electronic Materials", volume = "34", number = "8", year = "2005", pages = "1143-1149", url = "http://www.ingentaconnect.com/content/klu/jem/2005/00000034/00000008/art00009" } @article {Wu:2005:0361-5235:1150, author = "Wu, Wen-Fa and Tsai, Kou-Chiang and Chao, Chuen-Guang and Chen, Jen-Chung and Ou, Keng-Liang", title = "Novel Multilayered Ti/TiN Diffusion Barrier for Al Metallization", journal = "Journal of Electronic Materials", volume = "34", number = "8", year = "2005", pages = "1150-1156", url = "http://www.ingentaconnect.com/content/klu/jem/2005/00000034/00000008/art00010" } @article {Fellows:2005:0361-5235:1157, author = "Fellows, James A. and Yeo, Y.K. and Ryu, Mee-Yi and Hengehold, R.L.", title = "Electrical and Optical Activation Studies of Si-Implanted GaN", journal = "Journal of Electronic Materials", volume = "34", number = "8", year = "2005", pages = "1157-1164", url = "http://www.ingentaconnect.com/content/klu/jem/2005/00000034/00000008/art00011" } @article {Yim:2005:0361-5235:1165, author = "Yim, M.J. and Kim, H.J. and Paik, K.W.", title = "Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity for Flip Chip Applications", journal = "Journal of Electronic Materials", volume = "34", number = "8", year = "2005", pages = "1165-1171", url = "http://www.ingentaconnect.com/content/klu/jem/2005/00000034/00000008/art00012" } @article {Tan:2005:0361-5235:1172, author = "Tan, S.T. and Chen, B.J. and Sun, X.W. and Yu, M.B. and Zhang, X.H. and Chua, S.J.", title = "Realization of Intrinsic p-Type ZnO Thin Films by Metal Organic Chemical Vapor Deposition", journal = "Journal of Electronic Materials", volume = "34", number = "8", year = "2005", pages = "1172-1176", url = "http://www.ingentaconnect.com/content/klu/jem/2005/00000034/00000008/art00013" } @article {Yu:2005:0361-5235:1177, author = "Yu, H. and Mhaisalkar, S.G. and Wong, E.H.", title = "Cure Shrinkage Measurement of Nonconductive Adhesives by Means of a Thermomechanical Analyzer", journal = "Journal of Electronic Materials", volume = "34", number = "8", year = "2005", pages = "1177-1182", url = "http://www.ingentaconnect.com/content/klu/jem/2005/00000034/00000008/art00014" } @article {Egerton:2005:0361-5235:1183, author = "Egerton, E. James and Sood, Ashok K. and Singh, Rajwinder and Puri, Yash R. and Look, David C. and Steiner, Todd", title = "P-Type Doping Utilizing Nitrogen and Mn Doping of ZnO Using MOCVD for Ultraviolet Lasers and Spintronic Applications", journal = "Journal of Electronic Materials", volume = "34", number = "8", year = "2005", pages = "1183-1183", url = "http://www.ingentaconnect.com/content/klu/jem/2005/00000034/00000008/art00015" }