Novel Interconnection Method Using Electrically Conductive Paste with Fusible Filler

Authors: Kim, Jong-Min; Yasuda, Kiyokazu; Fujimoto, Kozo

Source: Journal of Electronic Materials, Volume 34, Number 5, May 2005 , pp. 600-604(5)

Publisher: Springer

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Abstract:

A new class of electrically conductive adhesives (ECAs) was developed using fusible filler particles. Differential scanning calorimetry (DSC) was used to examine the curing behavior of the base resin material and the melting behavior of the filler particles. The formation of the interconnection before and after the curing process was observed by means of a microfocus x-ray system. The cross-sectional morphology of the electrical conduction path was investigated by optical microscopy. It is believed that the wetting and coalescence behavior of the molten filler particles are the main driving forces leading to the production of the interconnection between the electrodes. In addition, the metallurgical connections both between the particles and between the particles and the copper substrate were observed using scanning electron microscopy and electron probe microanalysis (EPMA).

Keywords: CONDUCTIVE PATH; ELECTRICALLY CONDUCTIVE PASTE; FLUXLESS; LOW-MELTING-POINT ALLOY

Document Type: Regular Paper

Publication date: May 1, 2005

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