The application of lead-free solder to optical fiber packaging
Authors: Ou, Shengquan; Xu, Gu; Xu, Yuhuan; Tu, K.
Source: Journal of Electronic Materials, Volume 33, Number 12, December 2004 , pp. 1440-1444(5)
Abstract:To achieve precise, hermetic, and reliable optoelectronic packaging, we studied a novel technology for bonding fibers to v-grooved chips by metallic soldering. Multilayered metallization of Ti/Au, Ti/Cu/Au, or Ti/Ni/Au has been prepared to improve the poor bonding nature of solder on oxide surface. The eutectic 43Sn57Bi (wt.%) alloy, having a melting point of 139°C, was selected to bond the fibers to v-grooved chips. The alignment and adhesion tests result show that the precision packaging by soldering has a satisfied reliability in the range of working temperature from −40°C to 85°C. The metallic solder bonding is hermetic, and hence, it can isolate the optical device from ambient environment.
Document Type: Research Article
Affiliations: Email: firstname.lastname@example.org
Publication date: 2004-12-01