Journal of Electronic Materials

Foreword
pp. 1411-1411(1)
Authors: Chada, Srinivas; Turbini, Laura; Kang, Sung; Lin, Kwang-Lung; Notis, Michael; Yu, Jin

Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys
pp. 1412-1423(12)
Authors: Telang, A.; Bieler, T.; Lucas, J.; Subramanian, K.; Lehman, L.; Xing, Y.; Cotts, E.

Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints
pp. 1424-1428(5)
Authors: Tsai, C.; Luo, W.; Chang, C.; Shieh, Y.; Kao, C.

Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder
pp. 1429-1439(11)
Authors: Lehman, L.; Athavale, S.; Fullem, T.; Giamis, A.; Kinyanjui, R.; Lowenstein, M.; Mather, K.; Patel, R.; Rae, D.; Wang, J.; Xing, Y.; Zavalij, L.; Borgesen, P.; Cotts, E.

The application of lead-free solder to optical fiber packaging
pp. 1440-1444(5)
Authors: Ou, Shengquan; Xu, Gu; Xu, Yuhuan; Tu, K.

Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying
pp. 1445-1451(7)
Authors: Kao, Szu-Tsung; Duh, Jenq-Gong

Contact angle measurements of Sn-Ag and Sn-Cu lead-free solders on copper substrates
pp. 1452-1458(7)
Authors: Arenas, Mario; Acoff, Viola

The effects of electroplating parameters on the composition and morphology of Sn-Ag solder
pp. 1459-1464(6)
Authors: Kim, J.; Yu, J.; Lee, J.; Lee, T.

Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization
pp. 1465-1472(8)
Authors: Chen, Zhong; He, Min; Qi, Guojun

Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder: Part II—Aged condition
pp. 1473-1484(12)
Authors: Vianco, Paul; Rejent, Jerome; Kilgo, Alice

Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength
pp. 1485-1496(12)
Authors: Anderson, I.; Harringa, J.

Accelerated thermal fatigue of lead-free solder joints as a function of reflow cooling rate
pp. 1497-1506(10)
Authors: Spelt, J.; Qi, Y.; Zbrzezny, A.; Agia, M.; Lam, R.; Ghorbani, H.; Snugovsky, P.; Perovic, D.

Effects of load and thermal conditions on Pb-free solder joint reliability
pp. 1507-1515(9)
Authors: Liang, J.; Downes, S.; Dariavach, N.; Shangguan, D.; Heinrich, S.

Ceramics bonding using solder glass frit
pp. 1516-1523(8)
Authors: Sun, Z.; Pan, D.; Wei, J.; Wong, C.

Intermetallic phase detection in lead-free solders using synchrotron x-ray diffraction
pp. 1524-1529(6)
Authors: Jackson, Gavin; Lu, Hua; Durairaj, Raj; Hoo, Nick; Bailey, Chris; Ekere, Ndy; Wright, Jon

Effect of cooling rate on growth of the intermetallic compound and fracture mode of near-eutectic Sn-Ag-Cu/Cu pad: Before and after aging
pp. 1530-1544(15)
Authors: Jeong, Sang; Kim, Jong; Lee, Hyuck

Quantitative metallography of β-Sn dendrites in Sn-3.8Ag-0.7Cu ball grid array solder balls via electron backscatter diffraction and polarized light microscopy
pp. 1545-1549(5)
Authors: LaLonde, A.; Emelander, D.; Jeannette, J.; Larson, C.; Rietz, W.; Swenson, D.; Henderson, D.

Interfacial reaction study on a solder joint with Sn-4Ag-0.5Cu solder ball and Sn-7Zn-Al (30 ppm) solder paste in a lead-free wafer level chip scale package
pp. 1550-1556(7)
Authors: Chiang, Huann-Wu; Chen, Jun-Yuan; Lee, Jeffrey; Li, S.

Intermetallic compounds and adhesion strength between the Sn-9Zn-1.5Ag-0.5Bi lead-free solder and unfluxed Cu substrate
pp. 1557-1560(4)
Authors: Liu, Chih-Yao; Wang, Moo-Chin; Hon, Min-Hsiung

The effect of isothermal aging on the thickness of intermetallic compound layer growth between low melting point solders and Ni-plated Cu substrate
pp. 1561-1566(6)
Authors: Kim, Dae-Gon; Jung, Seung-Boo

A dynamic model for the assessment of the replacement of lead in solders
pp. 1567-1580(14)
Authors: Reuter, Markus; Verhoef, Ewoud

Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates
pp. 1581-1588(8)
Authors: Korhonen, Tia-Marje; Turpeinen, Pekka; Lehman, Lawrence; Bowman, Brian; Thiel, George; Parkes, Raymond; Korhonen, Mattt; Henderson, Donald; Puttlitz, Karl

An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation
pp. 1589-1595(7)
Authors: Chawla, N.; Shen, Y.; Deng, X.; Ege, E.

Effects of cooling rate on creep behavior of a Sn-3.5Ag alloy
pp. 1596-1607(12)
Authors: Ochoa, F.; Deng, X.; Chawla, N.