Novel Micro-Bump Fabrication for Flip-Chip Bonding

Authors: Ishii, Takao; Aoyama, Shinji

Source: Journal of Electronic Materials, Volume 33, Number 11, November 2004 , pp. 1411-1413(3)

Publisher: Springer

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Abstract:

This paper describes a new bump-fabrication technique for flip-chip connection between a chip and substrate. We propose a novel idea of forming solder microbumps on the substrate and directly bonding bare chips to the substrate. We successfully achieved the new flip-chip connection by using a 0.05Au-0.95Sn solder bump and a hydrogen-plasma reflow technique. Because the method eliminates the need for any process on the chip wafer, it will be very useful in fabricating flip-chip connections for low-cost packaging.

Keywords: FLIP-CHIP BONDING; MICRO-BUMP; SN-AU SOLDER

Document Type: Regular Paper

Publication date: November 1, 2004

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