Novel Micro-Bump Fabrication for Flip-Chip Bonding
Authors: Ishii, Takao; Aoyama, Shinji
Source: Journal of Electronic Materials, Volume 33, Number 11, November 2004 , pp. 1411-1413(3)
Abstract:This paper describes a new bump-fabrication technique for flip-chip connection between a chip and substrate. We propose a novel idea of forming solder microbumps on the substrate and directly bonding bare chips to the substrate. We successfully achieved the new flip-chip connection by using a 0.05Au-0.95Sn solder bump and a hydrogen-plasma reflow technique. Because the method eliminates the need for any process on the chip wafer, it will be very useful in fabricating flip-chip connections for low-cost packaging.
Document Type: Regular Paper
Publication date: November 1, 2004