Development of Creep-Resistant, Nanosized Ag Particle-Reinforced Sn-Pb Composite Solders
Authors: Liu, J.P.; Guo, F.; Yan, Y.F.; Wang, W.B.; Shi, Y.W.
Source: Journal of Electronic Materials, Volume 33, Number 9, 1 September 2004 , pp. 958-963(6)
Abstract:The physical properties, solderability, and creep-rupture life of the nanosized Ag particle-reinforced Sn-Pb composite solder were investigated. The experimental results indicate that the composite solder possesses good electrical conductivity as well as good solderability. Compared to the eutectic 63Sn-37Pb solder matrix, the nanosized Ag particle-reinforced composite solder improved the creep resistance and significantly enhanced the creep-rupture life of its solder joints. The fracture surface revealed a mixture of ductile and brittle fracture features.
Document Type: Regular Paper
Publication date: 2004-09-01