Thermodynamic Assessment of the Sn-Co Lead-Free Solder System
Authors: Liu, Libin; Andersson, Cristina; Liu, Johan
Source: Journal of Electronic Materials, Volume 33, Number 9, 1 September 2004 , pp. 935-939(5)
Abstract:The Sn-Co-Cu eutectic alloy can be a less expensive alternative for the Sn-Ag-Cu alloy. In order to find the eutectic solder composition of the Sn-Co-Cu system, the Sn-Co binary system has been thoroughly assessed with the calculation of phase diagram (CALPHAD) method. The liquid phase, the FCC and HCP Co-rich solid solution, and the BCT Sn-rich solid solution have been described by the Redlich–Kister model. The Hillert–Jarl–Inden model has been used to describe the magnetic contributions to Gibbs energy in FCC and HCP. The CoSn2, CoSn, Co3Sn2 _, and Co3Sn2 _α phases have been treated as stoichiometric phases. A series of thermodynamic parameters have been obtained. The calculated phase diagram and thermodynamic properties are in good agreement with the experimental data. The obtained thermodynamic data was used to extrapolate the ternary Sn-Co-Cu phase diagram. The composition of the Sn-rich eutectic point of the Sn-Co-Cu system was found to be 224˚C, 0.4% Co, and 0.7% Cu.
Document Type: Regular Paper
Publication date: 2004-09-01