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Volume 33, Number 4, 1 April 2004

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Pulsed Laser Annealing of Self-Organized InAs/GaAs Quantum Dots
pp. L5-L8(4)
Authors: Chakrabarti, S.; Fathpour, S.; Moazzami, K.; Phillips, J.; Lei, Y.; Browning, N.; Bhattacharya, P.

Low-Cycle Fatigue Characteristics of Sn-Based Solder Joints
pp. 249-257(9)
Authors: Lee, K. O.; Yu, Jin; Park, T. S.; Lee, S. B.

Development of a Novel Adaptive Lead-Free Solder Containing Reinforcements Displaying the Shape-Memory Effect
pp. 258-270(13)
Authors: Dutta, I.; Majumdar, B. S.; Pan, D.; Horton, W. S.; Wright, W.; Wang, Z. X.

Characterization of Nonconductive Adhesives for Flip-Chip Interconnection
pp. 271-276(6)
Authors: Teh, Lay Kuan; Wong, Chee Cheong; Mhaisalkar, Subodh; Ong, Kristine; Teo, Poi Siong; Wong, Ee Hua

Reaction Characteristics of the In-15Pb-5Ag Solder with a Au/Ni/Cu Pad and Their Effects on Mechanical Properties
pp. 277-282(6)
Authors: Lee, Jong-Hyun; Eom, Yong-Seong; Choi, Kwang-Seong; Choi, Byung-Seok; Yoon, Ho-Gyeong; Moon, Jong-Tae; Kim, Yong-Seog

Thermosonic Bonding of Gold Wire onto a Copper Pad with Titanium Thin-Film Deposition
pp. 290-299(10)
Authors: Aoh, Jong-Ning; Chuang, Cheng-Li

Transparent Flexible Plastic Substrates for Organic Light-Emitting Devices
pp. 312-320(9)
Authors: Hong, Yongtaek; He, Zhiqi; Lennhoff, Nancy S.; Banach, David A.; Kanicki, Jerzy

Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects
pp. 321-328(8)
Authors: Kariya, Yoshiharu; Hosoi, Takuya; Terashima, Shinichi; Tanaka, Masamoto; Otsuka, Masahisa

Low-Cycle Fatigue Prediction Model for Pb-Free Solder 96.5Sn-3.5Ag
pp. 329-333(5)
Authors: Kanchanomai, C.; Mutoh, Y.

Experimental Investigation on Mechanisms of Silicon Chemical Mechanical Polishing
pp. 334-339(6)
Authors: Estragnat, E.; Tang, G.; Liang, H.; Jahanmir, S.; Pei, P.; Martin, J. M.

Phase Transformations in Thermally Exposed Au-Al Ball Bonds
pp. 340-352(13)
Authors: Noolu, Naren; Murdeshwar, Nikhil; Ely, Kevin; Lippold, John; Baeslack, William

High Mobility Poly-Ge Thin-Film Transistors Fabricated on Flexible Plastic Substrates at Temperatures below 130°C
pp. 353-357(5)
Authors: Shahrjerdi, D.; Hekmatshoar, B.; Mohajerzadeh, S. S.; Khakifirooz, A.; Robertson, M.

Etching of As- and P-Based III-V Semiconductors in a Planar Inductively Coupled BCl3/Ar Plasma
pp. 358-363(6)
Authors: Lee, J. W.; Lim, W. T.; Baek, I. K.; Yoo, S. R.; Jeon, M. H.; Cho, G. S; Pearton, S. J.

Thermal Desorption of Ge Native Oxides and the Loss of Ge from the Surface
pp. 364-367(4)
Authors: Oh, Jungwoo; Campbell, Joe C.

Mechanisms for the Intermetallic Formation during the Sn-20In-2.8Ag/Ni Soldering Reactions
pp. 374-381(8)
Authors: Chuang, T. H.; Huang, K. W.; Lin, W. H.

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