Effect of Spin Coating on the Curing Rate of Epoxy Adhesive for the Fabrication of a Polymer Optical Waveguide
Authors: Uddin, M.A.; Chan, H.P.; Chow, C.K.; Chan, Y.C.
Source: Journal of Electronic Materials, Volume 33, Number 3, 1 March 2004 , pp. 224-228(5)
Abstract:Spin coating is a simple process for rapidly depositing thin, solid polymeric films onto relatively flat substrates. Evaporation occurs during spinning of the relatively volatile species in any solution. The curing behavior of spin-coated polymeric film is influenced by the evaporation of any reactive component. An investigation was carried out on a silicon substrate to study the effects of spin coating on the curing behavior of the epoxy adhesive. The degree of curing for both spin and without spin-coated epoxy adhesive was measured by Fourier-transform infrared spectroscopy (FTIR). A slower curing reaction rate was observed for the spin-coated epoxy adhesive. The composition gradient established by solvent evaporation during spinning is responsible for the slower curing reaction rate of the spin-coated epoxy adhesive. From this study, it is proposed to use solvents that are less volatile and allow a greater part of the thinning behavior to occur without significant changes in the fluid properties during the spinning process.
Document Type: Research article
Publication date: 2004-03-01