A novel approach to stabilize contact resistance of electrically conductive adhesives on lead-free alloy surfaces
Authors: Li, Haiying; Moon, Kyoung-Sik; Wong, C.
Source: Journal of Electronic Materials, Volume 33, Number 2, February 2004 , pp. 106-113(8)
Abstract:Electrically conductive adhesive (ECA) is an alternative for the toxic lead-based solders. However, unstable electrical conductivity has long been a haunting problem. Galvanic corrosion at the ECA/pad interface has recently been found to be the major mechanism for this decay. Applying a more active metal or alloy on a dissimilar metal couple in contact can prohibit galvanic corrosion. In this study, powders of aluminum, magnesium, zinc, and two aluminum alloys were added in an ECA and applied on five pad surfaces. The aging of the bulk resistivity and contact resistance of the ECA/metal surface pairs were studied. The two alloys significantly suppressed the increase of the contact resistance on all tested metal surfaces.
Keywords: Electrical conductive adhesive; corrosion; electrochemistry; electronics packaging; epoxy resin; galvanic corrosion; resistance stability; sacrificial anode; sacrificial metal; silver filler
Document Type: Research Article
Affiliations: Email: email@example.com
Publication date: February 1, 2004