Properties of Quad Flat Package Joints Using Sn-Zn-Bi Solder with Varying Lead-Plating Materials

Authors: Iwanishi, H.; Hirose, A.; Imamura, T.; Tateyama, K.; Mori, I.; Kobayashi, K.F.

Source: Journal of Electronic Materials, Volume 32, Number 12, 1 December 2003 , pp. 1540-1546(7)

Publisher: Springer

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Abstract:

The effects of plating materials (Sn-10Pb, Sn-3.5Ag, Sn-3Bi, Sn-0.7Cu, and Au/Pd/Ni) on Cu leads on quad flat package (QFP) joints using a Sn-8Zn-3Bi solder were investigated. The joints with Sn-3.5Ag plating and Sn-8Zn-3Bi solder had the slowest growth rate of interfacial reaction layers and the highest strength. The Ag dissolution into the interfacial reaction layers causes this increased strength. The Sn-Ag plating is the best plating material for Cu leads among the five kinds of plating using Sn-8Zn-3Bi solder.

Keywords: SN-ZN-BI SOLDER; LEAD PLATING; INTERFACIAL REACTION; QUAD FLAT; PACKAGE QFP; RELIABILITY

Document Type: Research article

Publication date: 2003-12-01