Isothermal Aging of Near-Eutectic Sn-Ag-Cu Solder Alloys and Its Effect on Electrical Resistivity
Authors: Cook, B.A.; Anderson, I.E.; Harringa, J.L.; Kang, S.K.
Source: Journal of Electronic Materials, Volume 32, Number 12, 1 December 2003 , pp. 1384-1391(8)
Abstract:Solder joints were prepared from seven eutectic and near-eutectic Sn-based compositions and characterized for electrical resistivity after 100 h and 1,000 h of isothermal aging at 423 K. The solder joint samples were prepared by hand soldering to copper substrates, and the post-heat treatment resistivity was measured at room temperature in a specially designed, four-point probe fixture. Compositions tested included Sn-3.5Ag, Sn-3.7Ag-0.9Cu, Sn-3.0Ag0.5Cu, Sn-3.6Ag-1.0Cu, and Sn-3.9Ag-0.6Cu. In addition, the effect of a minor addition of a fourth element, designed to improve high-temperature shear strength, was also evaluated in the compositions Sn-3.7Ag-0.6Cu-0.3Co and Sn-3.7Ag-0.7Cu-0.2Fe. The observed changes in electrical resistivity are discussed in terms of microstructural coarsening, diffusional transport from the substrate, and nucleation of precipitate phases.
Document Type: Research Article
Publication date: 1 December 2003