Positron-Defect Profiling in Cd1-xZnxTe Wafers after Saw Cutting
Authors: McNeil, Sean P.; Lynn, Kelvin G.; Weber, Marc H.; Szeles, Csaba; Soundararajan, Raji
Source: Journal of Electronic Materials, Volume 32, Number 6, 1 June 2003 , pp. 583-585(3)
Abstract:Near-surface damage induced by saw cutting of ingots of Cd1–xZnxTe was investigated by positron-defect depth profiling. The damage extends to several micrometers depth and depends on the cutting apparatus. The samples were polished and etched repeatedly, followed each time by positron-depth profiling. New subsurface damage created during the polishing process is observed. No new damage is observed after etching. Positron-depth profiling is suggested as a diagnostic tool to monitor the quality of sample surfaces.
Document Type: Research Article
Publication date: 1 June 2003