Interfacial Microstructure and Intermetallics Developed in the Interface between In Solders and Au/Ni/Ti Thin Films during Reflow Process

Authors: Shin, Keesam; Cho, Won-Gu; Kim, Young-Ho

Source: Journal of Electronic Materials, Volume 32, Number 6, 1 June 2003 , pp. 483-491(9)

Publisher: Springer

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Intermetallic phases and microstructures formed between In solder and Au/Ni/Ti thin films during reflow were characterized using x-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). Two types of two-step heat treatment were performed in a rapid thermal annealing (RTA) system or in a furnace to simulate the flip-chip solder-joining process. The AuIn2 and In27Ni10 intermetallic phases were observed after the two-step heat treatment at the lower temperature. Additional In-Ni intermetallic layers formed between the In27Ni10 and Ni layer,which was two-step heat treated at the higher temperature. This phase was identified as metastable InNi of CsCl type with a = ~3.1 Å by convergent-beam electron diffraction (CBED).


Document Type: Miscellaneous

Publication date: June 1, 2003

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