Phase formation and diffusion soldering in Pt/In, Pd/In, and Zr/Sn thin-film systems

Authors: Studnitzky, Thomas; Schmid-Fetzer, Rainer

Source: Journal of Electronic Materials, Volume 32, Number 2, February 2003 , pp. 70-80(11)

Publisher: Springer

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Abstract:

Potential candidates for thin-film diffusion soldering were investigated by analysis of phase formation and measurements of mechanical and thermal stability of thin-film bonds. Bilayers of Pt/In, Pd/In, and Zr/Sn of 500 nm/500 nm thickness were prepared by direct current magnetron sputtering followed by a 5 nm, thin protective Au layer. Single bilayer samples were heat-treated between 200°C and 500°C for 3-30 min and studied by x-ray diffraction (XRD) analysis. Some bilayers were bonded face-to-face between 300°C and 500°C for 3-30 min and sheared-off either in shear-strength measurements at room temperature or in remelting experiments up to 1,100°C. Phase formation in Pd/In and Pt/In thin films is much faster than in Zr/Sn thin films. An interaction of Au in addition to a questionable thermal stability of PtIn₂ complicated the reaction in Pt/In samples. A revised partial Pd-In phase diagram was constructed, correcting the compound `PdIn₃' to Pd₃In₇. The Pt/In and Pd/In thin-film systems are very promising candidates for thin-film diffusion soldering.

Keywords: Diffusion soldering; transient liquid-phase bonding; interface reactions and kinetics; thin-film reactions; Pd-In; Pt-In; Zr-Sn

Document Type: Research article

DOI: http://dx.doi.org/10.1007/s11664-003-0239-3

Affiliations: 1: Email: schmid-fetzer@tu-clausthal.de

Publication date: 2003-02-01