Pad Effects on Material-Removal Rate in Chemical-Mechanical Planarization

Authors: Bastawros, Ashraf; Chandra, Abhijit; Guo, Yongjin; Yan, Bo

Source: Journal of Electronic Materials, Volume 31, Number 10, 1 October 2002 , pp. 1022-1031(10)

Publisher: Springer

Buy & download fulltext article:

Price: $47.00 plus tax (Refund Policy)

Abstract:

The role of a porous pad in controlling material-removal rate (MRR) during the chemical-mechanical planarization (CMP) process has been studied numerically. The numerical results are used to develop a phenomenological model that correlates the forces on each individual abrasive particle to the applied nominal pressure. The model provides a physical explanation for the experimentally observed domains of pressure-dependent MRR, where the pad deformation controls the load sharing between active-abrasive particles and direct pad-wafer contact. The predicted correlations between MRR and slurry characteristics, i.e., particle size and concentration, are in agreement with experimentally measured trends reported by Ouma and Izumitani.

Keywords: CHEMICAL-MECHANICAL PLANARIZATION; MATERIAL-REMOVAL RATE; POROUS PAD; ABRASIVE PARTICLE; ASPERITY CONTACT

Document Type: Research article

Publication date: 2002-10-01