Thermomechanical Effects in Embedded Passive Materials

Authors: Slifka, A.J.; Drexler, E.S.

Source: Journal of Electronic Materials, Volume 31, Number 4, 1 April 2002 , pp. 286-291(6)

Publisher: Springer

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Abstract:

Thermomechanical fatigue was measured using electron-beam moiré (EBM) and infrared (IR) microscopy. A specimen was made using a FR-4 printed wiring board (PWB), a silver-filled conductive adhesive, and a carbon-filled conductive paste. Both filled polymeric materials are used for embedded resistor applications. We studied the behavior of these materials and, particularly, the interfaces between these materials as a function of thermal cycling. The EBM gives quantitative information on localized strains, whereas the IR microscopy gives quantitative information on changes in heat flow. The filled polymeric materials showed strains of -0.6% at -55°C and 1.4% at 125°C. The interface between the silver and carbon-filled materials increased in thermal resistance on the order of 10^-6 m² ⋅ K ⋅ W^-1 per thermal cycle.

Keywords: ELECTRON-BEAM MOIRE; EMBEDDED PASSIVE; INFRARED MICROSCOPY; THERMAL RESISTANCE; THERMOMECHANICAL FATIGUE

Document Type: Miscellaneous

Publication date: 2002-04-01